Distinguished Engineer AI Silicon Thermal Architecture

About this role

Build the Future of AI Computing

At ZutaCore, we're solving one of the biggest challenges facing the AI revolution: how to cool the world's most powerful processors.

Our patented HyperCool® two-phase liquid cooling technology enables next-generation AI infrastructure to operate at unprecedented compute densities while dramatically reducing energy and water consumption. As AI processors continue to push beyond today's thermal limits, cooling is becoming a critical enabler of future chip performance.

We're partnering with the world's leading silicon companies, hyperscalers, and server manufacturers to redefine thermal management for the next generation of AI computing.

If you're passionate about building technology that will shape the future of semiconductor innovation, we'd love to meet you.

The Role

As ZutaCore's Distinguished Engineer for AI Silicon Thermal Architecture, you will define the long-term vision for how thermal technologies evolve alongside next-generation AI silicon with a sharpening focus on integrating cooling directly into the package.

Rather than focusing on a single product, you'll work across emerging GPU, AI accelerator, and advanced packaging roadmaps to determine where cooling technology must go over the longer term while contributing directly, right now, to the product, technology, and partnership decisions that get us there.

Working closely with Product, Engineering, Business Development, and strategic silicon partners, you'll translate technology trends into product strategy and partnership opportunities that shape the future of our company.

What You'll Do

• Own ZutaCore's long-term AI silicon thermal integration roadmap and help drive the near-term milestones.
• Evaluate emerging AI architectures, advanced-packaging technologies, and power-delivery trends to define future cooling strategies.
• Develop the strategies for integrating cooling into the package across the lid/IHS, interposer, and substrate that meet the fu...